INRF services
In addition to the clean room, processing equipment, materials and chemicals, the INRF
can provide some assistance to researchers needing processing. Users are entitled to
training assistance from the INRF staff. However, the INRF staff generally will not
perform processing on behalf of the users.
The INRF can perform basic microfabrication operations for a predetermined fee. Operations
are performed on a scheduled basis only (no rush jobs accepted). Services include:
- One-mask lithography
Wafer materials less than 4 in diameter, Shipley 1827 photoresist, single mask
(provided by user), Karl Suss aligner
- Metalization
Standard metals include gold, titanium, chrome, nickel. E-beam or thermal
evaporation only.
- Plasma etch
Reactive ion etch of silicon oxide or silicon nitride only. Less than 1 micron
thickness. Oxygen etch of polymer also performed.
Contact the INRF for more details and a current price list.
Other services may be performed, but the details of the job must be discussed with
INRF staff. The INRF will provide a quote for the job with an estimate of the cost and
time to complete. The INRF will not perform design work or process development.
Clients seeking those services are encouraged to contact INRF faculty groups
directly to set up a research project.
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